Mijing Z21 IC CPU BGA Reballing Fixture for A8 A9 A10 A11 A12 A13 A14 A14S A15 Repair Kit with Stencil

MIJING Z21 10 in 1 Middle Layer Planting Tin Platform For iPhone 6-12mini/12 Pro Max 13 Motherboard Positioning Chip BGA Planting Tin

Usage Steps
01 : Place the chip in the positioning area (place it according to the direction indicated by the positioning area/stencil )
02 : Select the suitable tin planting net and place it according to the direction of the chip
03 : Check the alignment of the tin planting net and the chip tin position (the steel net has a special limit)
04 : Use a solder scraper to evenly fill the tin paste area to be planted
05 : Use an air gun to blow tin into a ball above the stencil(tweezers can be used to assist)